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Global Back Grinding Tapes (BGT) Market Research Report 2022 Professional Edition

TechnologyGlobal Back Grinding Tapes (BGT) Market Research Report 2022 Professional Edition

The global Back Grinding Tapes (BGT) market was valued at 198.3 Million USD in 2021 and will grow with a CAGR of 4.75% from 2021 to 2027, based on Research newly published report.

The prime objective of this report is to provide the insights on the post COVID-19 impact wwhich will help market players in this field evaluate their business approaches. Also, this report covers market segmentation by major market verdors, types, applications/end users and geography(North America, East Asia, Europe, South Asia, Southeast Asia, Middle East, Africa, Oceania, South America).

BGT (Backside Grinding Tape) is used to protect the wafer surface during back grinding after the IC is formed on the wafer. Attached on the circuit surface, it prevents damages to the circuit surface and pollutions to the wafer surface and improves the grinding accuracy of the wafer. Especially, it can perfectly protect the wafer pattern surface and the chip during the manufacturing process with its excellent physical and chemical properties. With developments of jumbo-sized and thinned wafer and high-bumped wafer, the function required to the BG tape are (1) low contamination levels, (2) highly close contact to wafer-, and (3) easiness of peeling.At present, the Back Grinding Tapes industry is generally at a more advanced level in Japan, the world`s large enterprises are mainly concentrated in Japan. Meanwhile, Japan companies have more advanced equipment, strong R & D capability, the technical level is in a leading position. There are major two classification of Back Grinding Tapes in this report, UV Type BGT, Non-UV Type BGT. Globally, the production value share of each type of Back Grinding Tapes is 40.46% and 59.54% in 2017.

By Market Verdors:

Mitsui Chemicals Tohcello

Nitto

LINTEC

Furukawa Electric

Denka

D&X

AI Technology

By Types:

UV Type

Non-UV Type

By Applications:

Standard

Standard Thin Die

(S)DBG (GAL)

Bump

Key Indicators Analysed

Market Players & Competitor Analysis: The report covers the key players of the industry including Company Profile, Product Specifications, Production Capacity/Sales, Revenue, Price and Gross Margin 2016-2027 & Sales with a thorough analysis of the market’s competitive landscape and detailed information on vendors and comprehensive details of factors that will challenge the growth of major market vendors.

Global and Regional Market Analysis: The report includes Global & Regional market status and outlook 2016-2027. Further the report provides break down details about each region & countries covered in the report. Identifying its sales, sales volume & revenue forecast. With detailed analysis by types and applications.

Market Trends: Market key trends which include Increased Competition and Continuous Innovations.

Opportunities and Drivers: Identifying the Growing Demands and New Technology

Porters Five Force Analysis: The report provides with the state of competition in industry depending on five basic forces: threat of new entrants, bargaining power of suppliers, bargaining power of buyers, threat of substitute products or services, and existing industry rivalry.

Key Reasons to Purchase

To gain insightful analyses of the market and have comprehensive understanding of the global market and its commercial landscape.

Assess the production processes, major issues, and solutions to mitigate the development risk.

To understand the most affecting driving and restraining forces in the market and its impact in the global market.

Learn about the market strategies that are being adopted by leading respective organizations.

To understand the future outlook and prospects for the market.

Besides the standard structure reports, we also provide custom research according to specific requirements

Table of content

1 Report Overview

1.1 Study Scope

1.2 Key Market Segments

1.3 Players Covered: Ranking by Back Grinding Tapes (BGT) Revenue

1.4 Market Analysis by Type

1.4.1 Global Back Grinding Tapes (BGT) Market Size Growth Rate by Type: 2021 VS 2027

1.4.2 UV Type

1.4.3 Non-UV Type

1.5 Market by Application

1.5.1 Global Back Grinding Tapes (BGT) Market Share by Application: 2022-2027

1.5.2 Standard

1.5.3 Standard Thin Die

1.5.4 (S)DBG (GAL)

1.5.5 Bump

1.6 Study Objectives

1.7 Years Considered

1.8 Overview of Global Back Grinding Tapes (BGT) Market

1.8.1 Global Back Grinding Tapes (BGT) Market Status and Outlook (2016-2027)

1.8.2 North America

1.8.3 East Asia

1.8.4 Europe

1.8.5 South Asia

1.8.6 Southeast Asia

1.8.7 Middle East

1.8.8 Africa

1.8.9 Oceania

1.8.10 South America

1.8.11 Rest of the World

2 Market Competition by Manufacturers

2.1 Global Back Grinding Tapes (BGT) Production Capacity Market Share by Manufacturers (2016-2021)

2.2 Global Back Grinding Tapes (BGT) Revenue Market Share by Manufacturers (2016-2021)

2.3 Global Back Grinding Tapes (BGT) Average Price by Manufacturers (2016-2021)

2.4 Manufacturers Back Grinding Tapes (BGT) Production Sites, Area Served, Product Type

3 Sales by Region

3.1 Global Back Grinding Tapes (BGT) Sales Volume Market Share by Region (2016-2021)

3.2 Global Back Grinding Tapes (BGT) Sales Revenue Market Share by Reg

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